Heated Bed Power MOSFET Expansion Module 25A 12-24V for 3D Printer

Feature: Heated bed power module Based on powerful MOSFET HA210NO6 Size: 60x50mm Mounting holes: 3.2mm diameter, for M3 screws. Distance betweeen holes: 54x43mm Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle Voltage: 12V-24V Maximum current with active cooling: 210A This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this) Under the premise of normal cooling, it work stable under I(Max)=25A, the current must not exceed 25A while the process working